Antifuse with nonstoichiometric tin layer and method of manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257529, 257764, H01L 2702

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active

053291530

ABSTRACT:
An antifuse in an integrated circuit which has first and second conducting lines, a semiconductor layer of amorphous silicon between the first and second conducting lines, and a barrier metal layer of TiN between the semiconductor layer and the first conducting layer is disclosed. The TiN layer is nonstoichiometric composition to enhance the probability of said antifuse having a desired resistance when said antifuse is programmed. More specifically, the TiN layer has a composition of Ti.sub.1.0 N.sub.0.5-0.8.

REFERENCES:
patent: 3571673 (1971-03-01), Ovshinsky
patent: 3675090 (1972-07-01), Neale
patent: 4442507 (1984-04-01), Roesner
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4796074 (1989-01-01), Roesner
patent: 4914055 (1990-04-01), Gordon et al.
patent: 5070384 (1991-12-01), McCollum et al.
patent: 5191550 (1993-03-01), Kubota
"Amorphous Silicon Antifuse Technology for Bipolar PROMS" 1986 Bipolar Circuits and Technology Meeting-1986 IEEE pp. 99-100.

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