Anti-stiction technique for thin film and wafer-bonded...

Details Anti-stiction technique for thin film and wafer-bonded... Anti-stiction technique for thin film and wafer-bonded...

2007-05-22

2007-05-22

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257S419000, C438S048000, C438S050000

Reexamination Certificate

active

11172118

ABSTRACT:
In one aspect, there is described a thin film or wafer encapsulated electromechanical device. In one embodiment of this aspect of the invention, the electromechanical device comprises a substrate, a mechanical structure disposed over the substrate wherein an anti-stiction layer is disposed on at least a portion of the mechanical structure, a wafer bonded encapsulation structure, disposed over the mechanical structure, to seal a chamber, an anti-stiction channel, etched into the substrate, to provide access to at least a portion of the mechanical structure disposed in the chamber, and an anti-stiction plug, disposed over or in the anti-stiction channel, to re-seal the chamber.

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