Anti-leakage apparatus

Details Anti-leakage apparatus Anti-leakage apparatus

1998-11-06

2000-08-15

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429803, 20429809, 48193, 48194, 137455, 137456, 137461, C23C 1434

Patent

active

061030791

ABSTRACT:
An anti-microleakage apparatus is used in a sputtering deposition equipment. A metallic object, such as a wafer, is put in a process chamber. A cryo-pump is used to vacuumed the process chamber. A heater to heat up the process chamber to allow a thermal reaction. The heater is movable and is coupled to an inner bellows line, which allows a low pressure gas can be flushed into the process chamber. The anti-microleakage apparatus is formed on the inner bellows line by wrapping the inner bellows line with an outer bellows line. A higher pressure is created between the inner bellows line and the outer bellow line by filling in a gas. A pressure meter is coupled to the outer bellows line so as to monitor the actual pressure of the higher pressure. When microleakage occurs, the information cab obtained by the pressure meter.

REFERENCES:
patent: 3908461 (1975-09-01), Turpen
patent: 5885358 (1999-03-01), Maydan et al.
patent: 5942089 (1999-08-01), Sproul et al.
patent: 5951834 (1999-09-01), Satoh
JP 3-166366 abstract, Jul. 1991.

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