Anti-corrosion treatment for patterning of metallic layers

Details Anti-corrosion treatment for patterning of metallic layers Anti-corrosion treatment for patterning of metallic layers

1985-08-30

1987-05-26

Kittle, John E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156652, 156656, 1566571, 156664, 156665, 430313, 430316, 430318, B44C 122

Patent

active

046683356

ABSTRACT:
An improved method is provided for defining interconnect patterns in an integrated circuit fabricated on a semiconductor wafer. The improvement comprises the step of immersing the wafer in a weak base solution, prior to etching a titanium-tungsten barrier layer, so as to remove from the wafer chlorides and flourides remaining as a result of a previous step of etching a conductor layer. In a preferred embodiment of the invention, a step of immersing the wafer in a strong acid solution is also performed to remove chlorides from the wafer.

REFERENCES:
patent: 4267012 (1981-05-01), Pierce et al.
patent: 4325984 (1982-04-01), Galfo et al.
patent: 4547260 (1985-10-01), Takada et al.
Thompson et al, Introduction to Microlithography, American Chemical Society, Washington, D.C., 1983, pp. 243-244.
Harrison et al., The Use of Anti-Reflection Coatings for Photoresist Linewidth Control, National Semiconductor Co., 1983, pp. 1-18.

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