Anodization control for forming offset between semiconductor cir

Details Anodization control for forming offset between semiconductor cir Anodization control for forming offset between semiconductor cir

1997-10-30

2000-03-07

Fahmy, Wael

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

438157, 438163, 438165, H01L 2189

Patent

active

060339403

ABSTRACT:
A circuit substrate includes a plurality of semiconductor devices including electrodes, a wiring having a plurality of branched portions and mainly formed of a metal material, a terminal for applying a voltage to the wiring to anodize the branched portions, and an anodization controller for controlling degrees of anodization of the branched portions. The branched portions serve as the electrodes of the semiconductor devices. The terminal is connected to the wiring.

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