Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1996-01-23
1997-11-04
Breneman, R. Bruce
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419222, 20419223, 20429806, 20429814, 20429816, 20429819, 20429821, 20429822, 20429808, 118723E, 156345, C23C 1434
Patent
active
056835582
ABSTRACT:
An elongated anode structure having multiple points to which electrons are attracted is provided. The anode can be constructed of multiple wire brushes that are attached to a metal rod. Use of the anode in magnetron systems significantly reduces dielectric material build-up and improves film uniformity in both dc reactive and non-reactive sputtering. Moreover, the anode reduces overheating and increases the operation time of magnetron systems undergoing reactive sputtering of dielectric materials. In one embodiment, the magnetron system has a cylindrical cathode and a pair of elongated anodes positioned parallel to and equidistance from the cathode. The anode structure is particularly suited for sputtering uniform films of dielectric materials, including silicon dioxide and silicon nitride.
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Hill Russell J.
Schulz Stephen C.
Sieck Peter A.
Vossen John L.
Breneman R. Bruce
Draegert David A.
McDonald Rodney G.
Pace Salvatore P.
The BOC Group Inc.
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