Anode structure for magnetron sputtering systems

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20429814, 20429819, 20429821, C23C 1434

Patent

active

054878217

ABSTRACT:
An elongated anode structure having multiple points to which electrons are attracted is provided. The anode can be constructed of multiple wire brushes that are attached to a metal rod. Use of the anode in magnetron systems significantly reduces dielectric material build-up and improves film uniformity in both dc reactive and non-reactive sputtering. Moreover, the anode reduces overheating and increases the operation time of magnetron systems undergoing reactive sputtering of dielectric materials. In one embodiment, the magnetron system has a cylindrical cathode and a pair of elongated anodes positioned parallel to and equidistance from the cathode. The anode structure is particularly suited for sputtering uniform films of dielectric materials, including silicon dioxide and silicon nitride.

REFERENCES:
patent: 3514391 (1970-05-01), Hablanian et al.
patent: 3594301 (1971-07-01), Bruch
patent: 3616449 (1971-10-01), Pellegrin
patent: 3767559 (1973-10-01), Agnone et al.
patent: 4046659 (1977-09-01), Cormia et al.
patent: 4166018 (1979-08-01), Chapin
patent: 4478702 (1984-10-01), Gillery et al.
patent: 4619755 (1986-10-01), Hessberger et al.
patent: 4849087 (1989-07-01), Meyer
patent: 4888199 (1989-12-01), Felts et al.
patent: 5047131 (1991-09-01), Wolfe et al.
patent: 5106474 (1992-04-01), Dickey et al.
patent: 5171411 (1992-12-01), Hillendahl et al.
Metals Handbook, 8th Ed., vol. 2, "Heat Treating, Cleaning and Finishing", American Society for Metals, Metals Park, Ohio, 1964, pp. 405-408.
WPI/Derwent Publications Ltd., Kolosov, V. V. et al., SU 180 8024 A3, Apr. 7, 1993; Abstract.
Chapin, "The Planar Magnetron," Research/Development Vacuum Technology, Jan. 1974, pp. 37-40 (p. 38 is not part of article and is not included).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Anode structure for magnetron sputtering systems does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Anode structure for magnetron sputtering systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Anode structure for magnetron sputtering systems will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-155317

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.