Anode slime reduction method while maintaining low current

Details Anode slime reduction method while maintaining low current Anode slime reduction method while maintaining low current

2005-01-18

2005-01-18

Bell, Bruce F. (Department: 1746)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S297010, C204S297080, C204S199000, C204S212000, C204S213000, C204S22400M, C204S232000, C204S237000, C204S252000, C204S255000, C204S275100, C204S286100, C204S287000, C205S292000

Reexamination Certificate

active

06843897

ABSTRACT:
Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

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Pedersen et al., U.S. Appl. No. US2001/0040099 A1, published Nov. 15, 2001, “Method And Apparatus For Providing Electrical And Fluid Communication To A Rotating Microelectronic Workpiece During Electrochemical Processing”.

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