Annealing methods of doping electrode surfaces using dopant gase

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor

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257309, H01L 218242

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active

059435844

ABSTRACT:
A method of doping a surface portion of a layer of an integrated circuit device includes the steps of forming a layer of a semiconductor material on an integrated circuit substrate and annealing the layer of the semiconductor material at a predetermined temperature while flowing a dopant gas over the layer of the semiconductor material. More particularly, the step of forming the layer of the semiconductor material can include forming a first sub-layer of the semiconductor material on the integrated circuit substrate and forming a second sublayer of the semiconductor material on the first sublayer where the second sublayer has an increased surface area. For example, the second sublayer can be a hemispherical grained silicon layer.

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