Anisotropically etched liquid level control structure

Details Anisotropically etched liquid level control structure Anisotropically etched liquid level control structure

1992-08-07

1994-10-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156647, 1566611, 156662, 156633, H01L 21306, B44C 122

Patent

active

053544196

ABSTRACT:
A liquid level control structure and a method for its production. The liquid level control structure is comprised of a wafer having substantially flat top and bottom surfaces and a channel for containing a marking fluid. The channel is defined by inwardly sloping walls that extend through the wafer and that join with the top surface of the wafer to define protrusions. The protrusions interact with the marking fluid's surface tension so as to control the location of an unbounded surface of the fluid within the channel.
An alternative embodiment liquid level control structure uses a thin film layer deposited over the wafer's top surface that extends over the protrusions to form lips. Those lips interact with the marking fluids surface tension to control the location of the unbounded surface.
The methods for producing the liquid level control structures use semiconductor fabrication techniques such as photolithography and anisotropic etching.

REFERENCES:
patent: 4106976 (1978-08-01), Chiou et al.
patent: 4308547 (1981-12-01), Lovelady et al.
patent: 4751530 (1988-06-01), Elrod et al.
patent: 4751534 (1988-06-01), Elrod et al.
patent: 5028937 (1991-07-01), Khuri-Yakub et al.
patent: 5041849 (1991-08-01), Quate et al.
patent: 5277754 (1994-01-01), Hadimioglu et al.
Chiou et al., Ink Jet Nozzles, IBM Technical Disclosure Bulletin, vol. 19, No. 9, Feb. 1977, p. 3569.

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