Anisotropic metal oxide etch

Details Anisotropic metal oxide etch Anisotropic metal oxide etch

1992-04-20

1993-08-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156654, 1566591, 156667, 152 79, B44C 122, C23F 100

Patent

active

052385299

ABSTRACT:
A metal oxide substrate (e.g. barium strontium titanate 34) is immersed in a liquid ambient (e.g. 12 molar concentration hydrochloric acid 30) and illuminated with radiation (e.g. collimated visible/ultraviolet radiation 24) produced by a radiation source (e.g. a 200 Watt mercury zenon arc lamp 20). A window 26 which is substantially transparent to the collimated radiation 24 allows the radiated energy to reach the metal oxide substrate 34. An etch mask 32 may be positioned between the radiation source 20 and the substrate 34. The metal oxide substrate 34 and liquid ambient 30 are maintained at a nominal temperature (e.g. 25.degree. C.). Without illumination, the metal oxide is not appreciably etched by the liquid ambient. Upon illumination the etch rate is substantially increased.

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