Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1998-10-08
2000-09-19
Potter, Roy
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257737, H01L 2348
Patent
active
061216887
ABSTRACT:
An anisotropic conductive sheet material includes a resin and conductive fillers, such as metallic particles, added in the resin. A conductive layer is formed on one of the surfaces of the anisotropic conductive sheet material. A circuit board includes a substrate having first and second surfaces and a circuit pattern being formed on the first surface of the substrate, an anisotropic conductive sheet having first and second surfaces, a circuit pattern being formed on the first surface thereof. The second surface of the anisotropic conductive sheet is adhered to the first surface of the substrate in such a manner that the circuit patterns are electrically connected to each other by means of the anisotropic conductive sheet. An electrically insulative layer formed on the first surface of the anisotropic conductive sheet to cover the circuit pattern thereof, except that external connecting portions thereof are exposed.
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Potter Roy
Shinko Electric Industries Co. Ltd.
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