Anhydride polymers for use as curing agents in epoxy...

Details Anhydride polymers for use as curing agents in epoxy... Anhydride polymers for use as curing agents in epoxy...

2007-04-10

2007-04-10

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C428S414000, C438S127000, C525S408000, C525S449000

Reexamination Certificate

active

11370465

ABSTRACT:
An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.

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patent: 2001-139669 (2001-05-01), None
Derwent accession No. 2002-173912 for Japanese No. 2001-139669, JSR Corporation, May 22, 2001.
CAPLUS accession No. 2007-372184 for Japanese No. 2001-139669, JSR Co., Ltd., May 22, 2001.

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