Angled transducer-dual head bonder for optimum ultrasonic power

Metal fusion bonding – Process – Plural joints

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228 45, 228 11, 2281101, 219 5621, 219 5622, 156 732, 438 26, 438 51, 438 55, 438 64, 438111, B23K 106, B23K 3102, B23K 3700, H01L 2144, H01L 2148

Patent

active

061129739

ABSTRACT:
A method of bonding wire between at least one pair of bond locations in a semiconductor device and the bonder. A conveyor is provided having a conveying surface for conveying in a predetermined direction a partially fabricated semiconductor device having first and second bonding locations. A first capillary is provided for forming a stitch bond to the first bonding location, the first capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal thereto and substantially parallel to the plane of the conveying surface. A stitch bond is formed on the first bonding location with the first capillary. The first capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. A second capillary is provided for forming a stitch bond to the second bonding location, the second capillary being disposed at an angle of about 45 degrees with respect to the predetermined direction and a line normal to the predetermined direction and substantially parallel to the plane of the conveying surface and a stitch bond is formed on the second bonding location with the second capillary. The second capillary is at an angle of substantially 45 degrees with respect to a line normal to the plane of the conveying surface. The first and second capillaries are disposed at an angle of about 90 degrees with respect to each other with respect to each other in a direction normal to said plane.

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patent: 5537737 (1996-07-01), Kamakura et al.
patent: 5544804 (1996-08-01), Test et al.
patent: 5702049 (1997-12-01), Biggs et al.
patent: 5735449 (1998-04-01), Magni
patent: 5944249 (1999-08-01), Macabitas et al.

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