Angled flying lead wire bonding process

Details Angled flying lead wire bonding process Angled flying lead wire bonding process

2003-12-16

2009-02-24

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE23024, C257SE23025

Reexamination Certificate

active

07495342

ABSTRACT:
A method is described having the steps of providing a surface having a plurality of wire bondable locations, wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

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patent: 5635846 (1997-06-01), Beaman et al.
patent: 5821763 (1998-10-01), Beaman et al.

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