Angle control of multi-cavity molded components for MEMS and...

Etching a substrate: processes – Etching of semiconductor material to produce an article...

Reexamination Certificate

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C216S017000, C216S041000, C216S088000, C438S689000, C438S692000

Reexamination Certificate

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11048611

ABSTRACT:
A method of making a mold includes forming spaced mold cavities in a mold body. The mold cavities include geometrically similar portions, but have respective depths below an initial reference surface that vary as a function of position along a particular direction. The mold cavities can be formed using anisotropic etching of preferred crystal directions in single crystal materials such as silicon. A portion of the mold material adjacent the initial reference surface is removed to expose a new reference surface at a tilt angle with respect to the initial reference surface. The modified mold cavities have their respective axes at a new desired tilt angle relative to the new reference surface.

REFERENCES:
patent: 6156243 (2000-12-01), Kosuga et al.
patent: 6392313 (2002-05-01), Epstein et al.
patent: 2002/0090580 (2002-07-01), Asanuma et al.
patent: 2002/0093906 (2002-07-01), Deno et al.

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