Semiconductor device manufacturing: process – With measuring or testing – Optical characteristic sensed
Patent
1996-02-12
1999-03-02
Dutton, Brian
Semiconductor device manufacturing: process
With measuring or testing
Optical characteristic sensed
G01R 3126, H01L 2166
Patent
active
058770356
ABSTRACT:
To enable observation, analysis and evaluation of minute foreign substances by adopting a method for enabling performance of linkage between equipment coordinates of a particle examination equipment and apparatus coordinates of an analyzing apparatus such as SEM which is not a particle examination equipment with a precision higher than that with which coordinate linkage is performed between conventional equipment and apparatus coordinates. An analyzing method for analyzing minute foreign substances includes the steps of determining the position of a minute foreign substance on the surface of a sample in a particle examination equipment, transferring the sample to a coordinate stage of an analyzing apparatus and inputting the position of the minute foreign substance determined by the particle examination equipment to thereby analyze the contents of this minute foreign substance. It is characterized by linking the equipment coordinates adopted by the particle examination equipment with the apparatus coordinates adopted by the analyzing apparatus by use of the same coordinate system based on the configurations of the sample.
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T. Hattori et al., "An Automated Particle Detection and Identification System in VLSI Wafer Processing," Solid State Technology, vol. 34, No. 9, Sep. 1991, pp. S01-S06.
Fujino Naohiko
Karino Isamu
Ohmori Masashi
Wakiyama Shigeru
Yasutake Masatoshi
Dutton Brian
Mitsubishi Denki & Kabushiki Kaisha
Seiko Instruments Inc.
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