Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-10-18
2005-10-18
Thompson, A. M. (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C716S030000
Reexamination Certificate
active
06957406
ABSTRACT:
The invention relates to a method for placing design components of an integrated circuit. A first site is selected. Other sites that are at maximum distances from already used sites may be selected. Components that have minimum connectivity to already placed components are selected. These components are used for preplacement. Preferably, the number of preplaced components is small. The rest of the design components are placed. An overlap ratio is computed. If the overlap ratio is above a predetermined value, the result is unplaced and additional components are preplaced. Another placement is performed. Overlap ratio is again computed. The steps of unplacing, adding preplaced components and computing overlap ratio are repeated until the overlap ratio falls below the predetermined value.
REFERENCES:
patent: 4630219 (1986-12-01), DiGiacomo et al.
patent: 5140402 (1992-08-01), Murakata
patent: 5308798 (1994-05-01), Brasen et al.
patent: 5398195 (1995-03-01), Kim
patent: 5748872 (1998-05-01), Norman
patent: 5812740 (1998-09-01), Scepanovic et al.
patent: 5867398 (1999-02-01), Scepanovic et al.
Vijayan, “Overlap elimination in floorplans”, Jan. 1991, IEEE, Fourth CSI/IEEE International Symposium on VLSI Design Preceedings, pp. 157-162.
Chan H. C.
Hoffman Bernard
Kanzaki Kim
Lin Sun James
Thompson A. M.
LandOfFree
Analytical placement methods with minimum preplaced components does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Analytical placement methods with minimum preplaced components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Analytical placement methods with minimum preplaced components will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3482332