Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1980-11-05
1982-03-16
Kimlin, Edward C.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156666, 252 795, B44C 122, C23F 100
Patent
active
043199550
ABSTRACT:
An improved ammoniacal alkaline etchant solution and method of reducing etchant undercut for use in etching copper and copper-containing alloy traces on substrates having resist-coated areas and non-coated areas, which reduces the amount of undercutting beneath the resist-coated areas that lie above the copper traces. The improved etchant solution contains an organic undercut inhibitor which can be either 5-nitro-1H indazole or pyrazole and the improved method includes the step of incorporating said organic undercut inhibitor in a standard ammoniacal alkaline cupric etchant solution. The organic undercut inhibitor causes the formation of a bath-insoluble, physically weak, etch-resistant film on the copper substrate. Said film serves to protect the side walls of an etched depression and thereby diminishes undercutting.
REFERENCES:
patent: 3773577 (1973-11-01), Shibasaki et al.
patent: 3948703 (1976-04-01), Kushibe
patent: 4060447 (1977-11-01), Nelson
patent: 4116699 (1978-09-01), Rooney
Kimlin Edward C.
Philip A. Hunt Chemical Corp.
Wine F. V.
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