Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2010-12-02
2011-12-06
Stoner, Kiley (Department: 1735)
Metal fusion bonding
Process
Plural joints
C228S207000, C228S223000, C228S224000, C228S248100, C148S023000, C148S024000
Reexamination Certificate
active
08070046
ABSTRACT:
An amine flux composition is provided, comprising, as an initial component: an amine fluxing agent represented by formula I:wherein R1, R2, R3and R4are independently selected from a hydrogen, a substituted C1-80alkyl group, an unsubstituted C1-80alkyl group, a substituted C7-80arylalkyl group and an unsubstituted C7-80arylalkyl group; wherein R7and R8are independently selected from a C1-20alkyl group, a substituted C1-20alkyl group, a C6-20aryl group and a substituted C6-20aryl group or wherein R7and R8, together with the carbon to which they are attached, form a C3-20cycloalkyl ring optionally substituted with a C1-6alkyl group; wherein R10and R11are independently selected from a C1-20alkyl group, a substituted C1-20alkyl group, a C6-20aryl group and a substituted C6-20aryl group or wherein R10and R11, together with the carbon to which they are attached, form a C3-20cycloalkyl ring optionally substituted with a C1-6alkyl group; and, wherein R9is selected from a hydrogen, a C1-30alkyl group, a substituted C1-30alkyl group, a C6-30aryl group and a substituted C6-30aryl group. Also provided is a method of soldering an electrical contact using the amine flux composition.
REFERENCES:
patent: 2632022 (1959-03-01), Bortnick
patent: 2897179 (1959-07-01), Schecter et al.
patent: 3488831 (1970-01-01), Ravve
patent: 3740831 (1973-06-01), Jordan et al.
patent: 3814638 (1974-06-01), Warwick et al.
patent: 4028143 (1977-06-01), Stayner et al.
patent: 4165244 (1979-08-01), Jacobs
patent: 4196024 (1980-04-01), Kenyon
patent: 4360144 (1982-11-01), Cuddy et al.
patent: RE32309 (1986-12-01), Hwang
patent: 5011546 (1991-04-01), Frazier et al.
patent: 5041169 (1991-08-01), Oddy et al.
patent: 5145722 (1992-09-01), Kaspaul
patent: 5256209 (1993-10-01), Chihara et al.
patent: 5531838 (1996-07-01), Arldt et al.
patent: 5571340 (1996-11-01), Schneider et al.
patent: 5599894 (1997-02-01), Ikeno
patent: 5863355 (1999-01-01), Ohno et al.
patent: 5932030 (1999-08-01), Fukasawa et al.
patent: 5958151 (1999-09-01), Gao et al.
patent: 5981682 (1999-11-01), Onishi
patent: 5989362 (1999-11-01), Diamant et al.
patent: 6063898 (2000-05-01), Endo et al.
patent: 6217671 (2001-04-01), Henderson et al.
patent: 6234381 (2001-05-01), Hasegawa et al.
patent: 6283360 (2001-09-01), Kumai et al.
patent: 6367150 (2002-04-01), Kirsten
patent: 6667194 (2003-12-01), Crane et al.
patent: 6758389 (2004-07-01), Odaka et al.
patent: 6887319 (2005-05-01), Suga et al.
patent: 6926849 (2005-08-01), Taguchi et al.
patent: 7009009 (2006-03-01), Crane et al.
patent: 7575150 (2009-08-01), Saito et al.
patent: 2001/0019075 (2001-09-01), Abe et al.
patent: 2001/0045244 (2001-11-01), Akaike et al.
patent: 2002/0089067 (2002-07-01), Crane et al.
patent: 2002/0190370 (2002-12-01), Shi et al.
patent: 2003/0032729 (2003-02-01), Takai et al.
patent: 2003/0073770 (2003-04-01), Klemarczyk et al.
patent: 2003/0111519 (2003-06-01), Kinney et al.
patent: 2003/0159761 (2003-08-01), Ikeda et al.
patent: 2004/0122208 (2004-06-01), Okada
patent: 2005/0048291 (2005-03-01), Woo et al.
patent: 2005/0048700 (2005-03-01), Rubinsztajn et al.
patent: 2005/0049334 (2005-03-01), Rubinsztain et al.
patent: 2005/0067395 (2005-03-01), Shindo et al.
patent: 2005/0129956 (2005-06-01), Rubinsztajn et al.
patent: 2005/0131106 (2005-06-01), Tonapi et al.
patent: 2005/0170188 (2005-08-01), Campbell et al.
patent: 2005/0181214 (2005-08-01), Campbell et al.
patent: 2005/0266263 (2005-12-01), Campbell et al.
patent: 2005/0288458 (2005-12-01), Klemarczyk et al.
patent: 2006/0020068 (2006-01-01), Elce et al.
patent: 2006/0102691 (2006-05-01), Toyama et al.
patent: 2006/0147683 (2006-07-01), Ikeda et al.
patent: 2006/0147719 (2006-07-01), Rubinsztajn et al.
patent: 2006/0192280 (2006-08-01), Esler et al.
patent: 2006/0219757 (2006-10-01), Rubinsztajn
patent: 2006/0272747 (2006-12-01), Wang et al.
patent: 2006/0275608 (2006-12-01), Tonapi et al.
patent: 2006/0275952 (2006-12-01), Gowda et al.
patent: 2007/0104959 (2007-05-01), Asano et al.
patent: 2007/0186997 (2007-08-01), Ikeda et al.
patent: 2007/0241170 (2007-10-01), Ikeda et al.
patent: 2007/0277373 (2007-12-01), Takai et al.
patent: 2007/0281097 (2007-12-01), Ikeno et al.
patent: 2008/0023108 (2008-01-01), Wang et al.
patent: 2008/0039542 (2008-02-01), Mills et al.
patent: 2008/0039560 (2008-02-01), Mills et al.
patent: 2008/0050552 (2008-02-01), Ahn et al.
patent: 2008/0066830 (2008-03-01), Gunji et al.
patent: 2008/0113297 (2008-05-01), Shibasaki et al.
patent: 2008/0124568 (2008-05-01), Duchesne et al.
patent: 2008/0156852 (2008-07-01), Prakash
patent: 2008/0179383 (2008-07-01), Sakurai et al.
patent: 2008/0214840 (2008-09-01), Klemarczyk et al.
patent: 2009/0018239 (2009-01-01), Woods et al.
patent: 2009/0123642 (2009-05-01), Sato
patent: 2009/0194319 (2009-08-01), Itoh et al.
patent: 2010/0041803 (2010-02-01), Dershem
patent: 2010/0041823 (2010-02-01), Dershem
patent: 2010/0041832 (2010-02-01), Dershem
patent: 2010/0143658 (2010-06-01), Lawrence
patent: 2010/0175790 (2010-07-01), Duchesne et al.
patent: 2011/0100512 (2011-05-01), Bedard et al.
patent: 2011/0152466 (2011-06-01), Dershem
patent: 2011/0177242 (2011-07-01), Kolowrot et al.
STIC search, no date available.
Copending U.S. Appl. No. 12/958,495.
Copending U.S. Appl. No. 12/958,487.
Copending U.S. Appl. No. 12/958,480.
Copending U.S. Appl. No. 12/958,473.
Fleming David D.
Gallagher Mike K.
Ho Kim Sang
Liu Xiang-Qian
Peera Asghar Akber
Deibert Thomas S.
Rohm and Haas Electronic Materials LLC
Stoner Kiley
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