Aluminum nitride sintered body having conductive metallized laye

Details Aluminum nitride sintered body having conductive metallized laye Aluminum nitride sintered body having conductive metallized laye

1987-02-19

1988-09-13

Kittle, John E.

Stock material or miscellaneous articles

Composite

Of inorganic material

428209, 428210, 428699, 428901, 501 96, 501152, 174 16HJ, 361386, B32B 900, C04B 3558

Patent

active

047709537

ABSTRACT:
For higher thermal conductivity, stronger adhesion strength, excellent insulating characteristics, and multilayer interconnection, an aluminium sintered body for circuit substrates comprises a novel conductive metallized layer on the surface of the sintered body. The metallized layer comprises at least one element selected from the first group of Mo, W and Ta and at least one element selected from the second group of IIa, III, IVa group elements, lanthanide elements, and actinide elements in the periodic table, as the conductive phase element. The first group element serves to improve the heat conductivity and resistance, while the second group serves to increase the wetness and adhesion strength between the insulating body and the metallized layer. Further, the plural insulating ceramic bodies and the plural metallized conductive layers can be sintered simultaneously being stacked one above the other to permit a multilayer interconnection.

REFERENCES:
patent: 4591537 (1986-05-01), Aldinger et al.
patent: 4649070 (1987-03-01), Kondo et al.
patent: 4659611 (1987-04-01), Iwase et al.
N. Kuramoto et al., "Proceedings of the 36th Electronic Components Conference", (IEEE) (1986), pp. 424-429.
Y. Kurakowa et al., "Proceedings of the 36th Electronic Components Conference", (IEEE) (1986), pp. 412-418.

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