1988-07-18
1989-09-12
Hille, Rolf
357 67, H01L 2354, H01L 2348, H01L 2312
Patent
active
048665053
ABSTRACT:
Non-uniform compressional, thermal dissipation and thermal expansion stresses in packaged chip devices are eliminated or substantially reduced by providing an aluminum attachment layer on the back side of wafers from which the chips themselves, to be mounted in the packaged chip devices, are produced. The aluminum-backed chips produced from such aluminum-backed wafers can be attached to cavities or tabs of packages such that essentially 100% attachment or bonding contact of the chip back side to the package is obtained when the chip is attached thereto with a gold eutectic preform material.
REFERENCES:
patent: 1837238 (1931-12-01), Siegmund
patent: 3099576 (1963-07-01), Mocanu
patent: 3622385 (1971-11-01), Stork
patent: 3781596 (1973-12-01), Galli et al.
patent: 3830657 (1974-08-01), Farrar
patent: 3925808 (1975-12-01), Rai-Choudbury
patent: 3941630 (1976-03-01), Larrabee
patent: 3943625 (1976-03-01), Brenan et al.
patent: 4025404 (1977-05-01), Joly et al.
patent: 4086375 (1978-04-01), LaChapelle, Jr.
patent: 4089106 (1978-05-01), Seidler
patent: 4179534 (1979-12-01), Chang et al.
patent: 4293587 (1981-10-01), Trueblood
patent: 4310569 (1982-01-01), Harrington
patent: 4378902 (1983-04-01), Fedak
patent: 4396900 (1983-08-01), Hall
patent: 4403411 (1983-09-01), Patton
patent: 4417387 (1983-11-01), Heslop
patent: 4441094 (1984-04-01), Levinson
patent: 4451972 (1984-06-01), Batinovich
patent: 4495255 (1985-01-01), Draper et al.
patent: 4554573 (1985-11-01), Yamamoto et al.
"Wafer-Chip Assembly for Large-Scale Integration"-Kraynak et al, IEEE Transactions on Electron Devices, vol. ED-15, No. 9, Sep. 1968.
Moseson Roger M.
Roberts Carl M.
Saxelby, Jr. John R.
Analog Devices Inc.
Clark S. V.
Hille Rolf
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