Alumina package for hermetically containing an electronic device

Details Alumina package for hermetically containing an electronic device Alumina package for hermetically containing an electronic device

1992-09-01

1994-01-11

Robinson, Ellis P.

Stock material or miscellaneous articles

Composite

Of quartz or glass

428 76, 428427, 428432, 428410, 428433, 501 15, 501 17, 501 21, 501 32, 501 66, 501905, B32B 1706

Patent

active

052779467

ABSTRACT:
In a borosilicate glass plate containing Li.sub.2 O, Na.sub.2 O and K.sub.2 O and for use as a window plate in an alumina package for containing a semiconductor device, Li.sup.+ and Na.sup.+ ions are partially ion-exchanged by K.sup.+ ions in a surface of the glass plate to form a surface layer having a compressive stress of 200 Kg.f/cm.sup.2 or more, in order to make a thin window glass plate for the package having a thickness of 0.7 mm or less and a sufficient mechanical strength. The glass also has a thermal expansion coefficient of 50-75.times.10.sup.-7 /.degree. C. over a temperature range of 30.degree.-380.degree. C. so as to be thermally compatible with the alumina package. The glass consists essentially of SiO.sub.2 55-64%, Al.sub.2 O.sub.3 7-20%, B.sub.2 O.sub.3 11-19%, Li.sub.2 O 0-8%, Na.sub.2 O 7-20%, K.sub.2 O 0-4%, and RO 0.5-7% on the base of weight percent, where R is at least one of Mg, Ca, Sr, and Ba. In order to insure the ion exchange, amounts of Li.sub.2 O, Na.sub.2 O and K.sub.2 O are adjusted so that (Li.sub.2 O+Na.sub.2 O/(Li.sub.2 O+Na.sub.2 O+K.sub.2 O) is 0.7 or more.

REFERENCES:
patent: 3506423 (1970-04-01), Morris
patent: 4089694 (1978-05-01), Thomas
patent: 4417913 (1983-11-01), Davis
patent: 4792535 (1988-12-01), Fine
patent: 4839313 (1989-06-01), Kondo
patent: 5045509 (1991-09-01), Kiefer

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