Alternating micro-vias and throughboard vias to create PCB...

Details Alternating micro-vias and throughboard vias to create PCB... Alternating micro-vias and throughboard vias to create PCB...

2008-04-29

2008-04-29

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

Reexamination Certificate

active

11200044

ABSTRACT:
A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.

REFERENCES:
patent: 6373139 (2002-04-01), Clark
patent: 6534872 (2003-03-01), Freda et al.
patent: 2004/0099440 (2004-05-01), Kwong et al.
patent: 2004/0136168 (2004-07-01), Duxbury et al.

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