Structure of mounting electronic component

Details Structure of mounting electronic component Structure of mounting electronic component

2008-04-08

2008-04-08

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257SE23021, C257SE21508, C438S108000, C438S613000

Reexamination Certificate

active

11041292

ABSTRACT:
The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit board without displacement. The structure of mounting an electronic component on a circuit board is characterized in that bumps of the electronic component are respectively flip-chip-bonded to electrodes of the circuit board by applying ultrasonic vibrations to the electronic component, and that a center of each of the bumps is previously relatively displaced, with respect to a center of each of the electrodes in a width direction, in a direction parallel to a direction of the ultrasonic vibrations.

REFERENCES:
patent: 5828128 (1998-10-01), Higashiguchi et al.
patent: 6602733 (2003-08-01), Iwahashi et al.
patent: 2004/0124007 (2004-07-01), Takeshi
patent: 2005/0012435 (2005-01-01), Nakano et al.
patent: 9-45810 (1997-02-01), None
patent: 2001-68594 (2001-03-01), None
patent: 2004-111543 (2004-04-01), None
patent: 2004-134649 (2004-04-01), None

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