Cleaning and liquid contact with solids – Processes – Hollow work – internal surface treatment
Reexamination Certificate
2007-11-13
2007-11-13
Carrillo, Sharidan (Department: 1746)
Cleaning and liquid contact with solids
Processes
Hollow work, internal surface treatment
C134S022110, C134S022140, C134S022160, C134S022170, C134S022190, C134S026000, C134S034000, C134S036000, C134S042000, C134S902000
Reexamination Certificate
active
11456259
ABSTRACT:
Compositions and methods for cleaning deposition systems utilizing alkylsilanes are described herein. In an embodiment, a method of cleaning a semiconductor fabrication system comprises flushing the system with a solvent comprising at least one alkylsilane. In another embodiment, a method of removing at least one chemical precursor from a semiconductor fabrication system comprises forcing a solvent containing at least one alkylsilane through the semiconductor fabrication system and dissolving the at least one chemical precursor in the solvent. The solvent may also contain mixtures of different alkylsilanes and other organic solvents.
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International Search Report for PCT/IB2006/003427.
Database WPI Week 199727, Derwent Publications Ltd., London, GB; AN 1997-295280, XP002431471 & JP 09 111299 (Sumitomo Chem. Co. Ltd.), Apr. 28, 1997 Abstract.
Girard Jean-Marc
Laxman Ravi
Misra Ashutosh
Air Liquide Electronics U.S. LP
Carrillo Sharidan
Clark Brandon
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