Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1990-04-03
1992-02-25
Brammer, Jack P.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430923, 430924, 522 63, 522120, 522143, G03C 176
Patent
active
050912828
ABSTRACT:
This invention includes a photosensitive composition containing an alkali-soluble resin and a compound represented by formula (I), (II) or (III) described in the claims and the specification, a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (IV) described in the claims and the specification and a basic compound, and a photosensitive composition containing an alkali-soluble polymer, a compound represented by formula (VI) described in the claims and the specification and a compound which produces an acid upon radiation of light. A pattern formation method using these photosensitive compositions includes the steps of dissolving any one of the above photosensitive compositions in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, and developing the exposed resin layer with an aqueous alkaline solution. When the first or second photosensitive composition is used, a good pattern can also be formed by a method including the steps of dissolving either the first or second photosensitive composition in an organic solvent to prepare a photosensitive resin solution, coating the photosensitive resin solution on a substrate to form a photosensitive resin layer on the substrate, pattern-exposing the photosensitive resin layer, heating the pattern-exposed resin layer, exposing the entire surface of the heated resin layer, and developing the entirely exposed resin layer with an aqueous alkaline solution.
REFERENCES:
patent: 4409317 (1985-10-01), Shirashi et al.
patent: 4902603 (1990-02-01), Slater
patent: 4910115 (1990-03-01), Simpson
patent: 4920028 (1990-04-01), Lazarus et al.
patent: 4939229 (1990-07-01), Bogan
patent: 4948694 (1990-08-01), Okaoma et al.
Hayase Rumiko
Kobayashi Yoshihito
Niki Hirokazu
Onishi Yasunobu
Ushirogouchi Toru
Brammer Jack P.
Kabushiki Kaisha Toshiba
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