Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Patent
1999-01-22
2000-06-13
Powell, William
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
438 8, 438747, 216 84, 216 88, 216 85, H01L 2100
Patent
active
060749504
ABSTRACT:
An alignment strategy for asymmetrical alignment marks in a wafer, in which the positions of the a symmetrical alignment marks are determined twice. A first set of positions is detected after a chemical-mechanical polishing step. A second set of positions is detected after a rotation in which the wafer is rotated by 180.degree. in the plane of the surface of the wafer.
REFERENCES:
patent: 5972798 (1999-10-01), Jang et al.
Huang Jiawei
Powell William
United Integrated Circuits Corp.
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