Alignment strategy for asymmetrical alignment marks

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

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438 8, 438747, 216 84, 216 88, 216 85, H01L 2100

Patent

active

060749504

ABSTRACT:
An alignment strategy for asymmetrical alignment marks in a wafer, in which the positions of the a symmetrical alignment marks are determined twice. A first set of positions is detected after a chemical-mechanical polishing step. A second set of positions is detected after a rotation in which the wafer is rotated by 180.degree. in the plane of the surface of the wafer.

REFERENCES:
patent: 5972798 (1999-10-01), Jang et al.

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