Alignment apparatus and method for mounting LSI and VLSI package

Details Alignment apparatus and method for mounting LSI and VLSI package Alignment apparatus and method for mounting LSI and VLSI package

1983-07-26

1984-10-30

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

357 70, 29827, 29759, 228 41, 228 6A, 228179, H01L 2160

Patent

active

044792980

ABSTRACT:
An apparatus for aligning the leads of an integrated circuit (IC) package with respect to the pads of the printed circuit board to which they will be bonded is presented. An alignment fixture, comprising a coarse alignment pedestal mounted on a fine alignment block, receives the IC package on the alignment fixture and aligns the leads with respect to a reference coordinate system of the alignment fixture. A vacuum chuck is lowered to contact the aligned package, and is then raised to lift the aligned package off the fine alignment block while holding it in the aligned position. An X-Y table positions the printed circuit board under the aligned package. The vacuum chuck lowers the aligned package until the leads contact the pads, and holds it while the leads are bonded to the pads.

REFERENCES:
patent: 3469684 (1969-09-01), Keady et al.
patent: 4010885 (1977-03-01), Keizer et al.
patent: 4116376 (1978-09-01), Delorme et al.
patent: 4224637 (1980-09-01), Hargis

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