Chemical stripping solution

Compositions – Compositions containing a single chemical reactant or plural... – Organic reactant

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Details

134 3, 134 38, 134 41, C11D 708, C23G 102

Patent

active

039621081

ABSTRACT:
A stripping solution comprising between 80 and 98% H.sub.2 SO.sub.4, between 0.5 and 4% HClO.sub.4, between 0.5 and 4% CrO.sub.3 and H.sub.2 O. The principal application of the solution is to remove polymerized photoresist layers formed during the manufacture of semiconductor devices.

REFERENCES:
patent: 3676219 (1972-07-01), Schroeder et al.
patent: 3728154 (1973-04-01), Suzuki
patent: 3787239 (1974-01-01), Schroeder et al.
patent: 3900337 (1975-08-01), Beck et al.

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