Aligned dummy metal fill and hole shapes

Details Aligned dummy metal fill and hole shapes Aligned dummy metal fill and hole shapes

2007-07-31

2007-07-31

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S666000, C257S659000

Reexamination Certificate

active

10908357

ABSTRACT:
Aligning metal fill shapes with corresponding holes of a metal shield is provided. The holes of the metal shield are laid out corresponding to a pre-selected grid referenced to a pre-selected origin. The metal fill shapes of the metal fill pattern, are arranged in accordance with the same pre-selected grid and referenced to the same pre-selected origin. Accordingly, regardless of the size or spacing of the metal fill holes, a metal fill shape will substantially align with a corresponding metal fill hole. Such alignment between metallization levels and the structure of the metal shield and metal fill shape pattern enhance the electric noise blocking properties of the metal shield in conjunction with the metal fill shape.

REFERENCES:
patent: 6217721 (2001-04-01), Xu et al.
patent: 6236115 (2001-05-01), Gaynes et al.
patent: 6399486 (2002-06-01), Chen et al.
patent: 6589594 (2003-07-01), Hembree
patent: 6638858 (2003-10-01), Cheng
patent: 2003/0124846 (2003-07-01), Chiang et al.

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