Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate
2007-12-04
2007-12-04
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
C257SE21021
Reexamination Certificate
active
11331763
ABSTRACT:
A semiconductor process and apparatus fabricate a metal gate electrode by forming a first conductive layer (22) over a gate dielectric layer (11), forming a transition layer (32) over the first conductive layer using an atomic layer deposition process in which an amorphizing material is increasingly added as the transition layer is formed, forming a capping conductive layer (44) over the transition layer, and then selectively etching the capping conductive layer, transition layer, and first conductive layer, resulting in the formation of an etched gate stack (52). By forming the transition layer (32) with an atomic layer deposition process in which the amorphizing material (such as silicon, carbon, or nitrogen) is increasingly added, the transition layer (32) is constructed having a lower region (e.g.,31, 33) with a polycrystalline structure and an upper region (e.g.,37, 39) with an amorphous structure that blocks silicon diffusion.
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Adetutu Olubunmi O.
Schaeffer James K.
Triyoso Dina H.
Cannatti Michael Rocco
Freescale Semiconductor Inc.
Geyer Scott B.
Hamilton & Terrile LLP
Patel Reema
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