Air blow apparatus for a semiconductor wafer

Details Air blow apparatus for a semiconductor wafer Air blow apparatus for a semiconductor wafer

1997-06-30

2000-02-01

Bennett, Henry

Drying and gas or vapor contact with solids

Apparatus

For slender rigid articles

432239, F26B 2500

Patent

active

060188847

ABSTRACT:
An air blow apparatus peels wafers off and simultaneously removes grease and grindstone grains by blowing air into gaps formed between semiconductor wafers sliced by a wire saw from a semiconductor ingot. Two injection nozzles 1a, 1b are symmetrically mounted at predetermined positions with respect to the central line c of the semiconductor wafer 10. Air injections 11a, 11b are injected from the outer top of the semiconductor wafer 10. Injection nozzles 1a, 1b are arranged so that they are movable in the longitudinal direction of the semiconductor ingot. Air injections 11a, 11b are set to be blown out at a cone shape of about 30 degrees.

REFERENCES:
patent: 4941490 (1990-07-01), Gross

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