Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-05-02
1989-06-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156345, 204298, B44C 122, H01L 21306, C03C 1500, C03C 2506
Patent
active
048426806
ABSTRACT:
A complete integrated circuit processing module, wherein multiple processing stations, each with its own vacuum isolation, are located inside a single module which is held at hard vacuum. A wafer transport arm mechanism permits interchange of wafers among the processing stations and a load lock. The load lock is equipped to remove and replace wafers from a vacuum-sealed wafer carrier. The wafers remain face-down and under hard vacuum during all the wafer handling steps.
REFERENCES:
patent: 4483651 (1984-11-01), Nakane et al.
patent: 4547247 (1985-10-01), Warenback et al.
patent: 4659413 (1987-04-01), Davis et al.
Drytek Inc., Quad System, Brochure pp. 1-11.
Carter Duane E.
Davis Cecil J.
Wooldridge Timothy J.
Comfort James T.
Powell William A.
Rogers Joseph E.
Sharp Melvin
Texas Instruments Incorporated
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