Advanced vacuum processor

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156345, 204298, B44C 122, H01L 21306, C03C 1500, C03C 2506

Patent

active

048426806

ABSTRACT:
A complete integrated circuit processing module, wherein multiple processing stations, each with its own vacuum isolation, are located inside a single module which is held at hard vacuum. A wafer transport arm mechanism permits interchange of wafers among the processing stations and a load lock. The load lock is equipped to remove and replace wafers from a vacuum-sealed wafer carrier. The wafers remain face-down and under hard vacuum during all the wafer handling steps.

REFERENCES:
patent: 4483651 (1984-11-01), Nakane et al.
patent: 4547247 (1985-10-01), Warenback et al.
patent: 4659413 (1987-04-01), Davis et al.
Drytek Inc., Quad System, Brochure pp. 1-11.

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