Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-11-17
2009-06-16
Wilczewski, M. (Department: 2822)
Semiconductor device manufacturing: process
With measuring or testing
C438S004000, C438S005000, C438S780000, C430S327000, C430S935000
Reexamination Certificate
active
07547561
ABSTRACT:
An advanced process control (APC) architecture comprising a process model that incorporates a target offset term is provided. The APC architecture may be applied to a so-called develop inspect critical dimension (DICD) model using the target offset term to correct at least one exposure parameter on the occurrence of an abrupt event. A corresponding event may, for example, concern a modified reflectivity of processed substrates, for example due to a rework of substrates covered by amorphous carbon material.
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Becker Andreas
Mazur Martin
Schulze Uwe
Advanced Micro Devices , Inc.
Wilczewski M.
Williams Morgan & Amerson
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