Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2006-07-18
2006-07-18
Nguyen, George (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S057000, C205S222000, C438S069000, C156S345120
Reexamination Certificate
active
07077725
ABSTRACT:
In advanced electrolytic polish (AEP) method, a metal wafer (10) acts as an anodic electrodes and another metal plate (65) is used as a cathodic electrode. A voltage differential is applied to the anode and cathode under a predetermined anodic dissolution current density. This causes a reaction that provides a planarized surface on the metal wafers. Additives are included in the electrolyte solution (55) which adsorb onto the wafer surface urging a higher removal rate at higher spots and a lower removal rate at lower spots. Also, in another embodiment of the present invention is a pulsed-electrolytic process (260) in which positive and negative potentials are applied to the anodic and cathodic electrodes alternately, further encouraging surface planarization. AEP can be used either as a first step followed by a mechanical polish or a second step between initial CMP polish and a third step mechanical polish. The present invention may also be added as a last step of copper electroplating process and so may be used in the manufacture of all kinds of patterned metal wafers.
REFERENCES:
patent: 3162588 (1964-12-01), Bell
patent: 3448023 (1969-06-01), Bell
patent: 4396467 (1983-08-01), Anthony
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4496436 (1985-01-01), Inoue
patent: 4720280 (1988-01-01), Hufnagl et al.
patent: 4789437 (1988-12-01), Sing et al.
patent: 4839005 (1989-06-01), Katsumoto et al.
patent: 4869971 (1989-09-01), Nee et al.
patent: 4956056 (1990-09-01), Zubatova et al.
patent: 5032238 (1991-07-01), Ishimura et al.
patent: 5039381 (1991-08-01), Mullarkey
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5114548 (1992-05-01), Rhoades
patent: 5141602 (1992-08-01), Chen et al.
patent: 5217586 (1993-06-01), Datta et al.
patent: 5256565 (1993-10-01), Bernhardt et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5522965 (1996-06-01), Chisholm et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5637031 (1997-06-01), Chen
patent: 5637185 (1997-06-01), Murarka et al.
patent: 5664990 (1997-09-01), Adams et al.
patent: 5683538 (1997-11-01), O'Neill et al.
patent: 5705230 (1998-01-01), Matanabe et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5827435 (1998-10-01), Samukawa
patent: 5846398 (1998-12-01), Carpio
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5952083 (1999-09-01), Parthasarathi et al.
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6010964 (2000-01-01), Glass
patent: 6027630 (2000-02-01), Cohen
patent: 6056864 (2000-05-01), Cheung
patent: 6066030 (2000-05-01), Uzoh
patent: 6074284 (2000-06-01), Tani et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6203684 (2001-03-01), Taylor et al.
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6242343 (2001-06-01), Yamazaki et al.
patent: 6248222 (2001-06-01), Wang
patent: 6251235 (2001-06-01), Talieh et al.
patent: 6258220 (2001-07-01), Dordi et al.
patent: 6261157 (2001-07-01), Bajaj et al.
patent: 6261433 (2001-07-01), Landau
patent: 6261478 (2001-07-01), Udaka
patent: 6291081 (2001-09-01), Kurabe et al.
patent: 6299741 (2001-10-01), Sun et al.
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6328872 (2001-12-01), Talieh et al.
patent: 6354916 (2002-03-01), Uzoh et al.
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6386956 (2002-05-01), Sato et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6409904 (2002-06-01), Uzoh et al.
patent: 6440495 (2002-08-01), Wang
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6630059 (2003-10-01), Uzoh et al.
patent: 6726823 (2004-04-01), Wang et al.
patent: 6749728 (2004-06-01), Wang
patent: 2001/0035354 (2001-11-01), Ashjaee et al.
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0040100 (2001-11-01), Wang
patent: 2001/0042690 (2001-11-01), Taliah
patent: 2002/0008036 (2002-01-01), Wang
patent: 2002/0011417 (2002-01-01), Taliah et al.
patent: 2002/0020621 (2002-02-01), Uzoh et al.
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 2002/0072309 (2002-06-01), Sato et al.
patent: 2002/0088715 (2002-07-01), Taliah et al.
patent: 2002/0160698 (2002-10-01), Sato et al.
patent: 2003/0104762 (2003-06-01), Sato et al.
patent: 2003/0114004 (2003-06-01), Sato et al.
patent: 0455455 (1991-11-01), None
patent: 0738561 (1996-10-01), None
patent: 0905754 (1999-03-01), None
patent: 53-37543 (1978-06-01), None
patent: 11238703 (1999-08-01), None
patent: 2001-77117 (2001-03-01), None
patent: WO98/49723 (1998-11-01), None
patent: WO99/26758 (1999-06-01), None
patent: WO 99/53119 (1999-10-01), None
patent: WO99/54527 (1999-10-01), None
patent: WO99/65072 (1999-12-01), None
patent: WO00/03428 (2000-01-01), None
patent: WO00/26443 (2000-05-01), None
patent: WO 00/33356 (2000-06-01), None
patent: WO00/59682 (2000-10-01), None
patent: WO 01/88229 (2001-11-01), None
patent: WO 02/23616 (2002-03-01), None
Partial European Search Report for EP 00 31 0560, dated Dec. 12, 2003. Reference No. 56125000/EA6968.
Contolini et al, Electrochemical planarization of ULSI copper, Solid State Technology, Jun. 1997, pp. 155-161, vol. 40, No. 6, Cowan Pub. Corp., Washington, USA.
Yu et al., “Dishing effects in a chemical mechanical polishing planarization process for advanced trench isolation,” Appl. Phys. Let. vol. 62 (11), Sep. 14, 1992, pp. 1344-46.
Gandikota et al., “Electrochemical Deposition for High Aspect Ratio Structures Using Electrical Pulse Modulation”, filed May 11, 2000, U.S. Appl. No. 09/569,833.
Dordi, et al., “Electrodeposition Chemistry for Improved Filling of Apertures,” filed Feb. 5, 1999, U.S. Appl. No. 09/245,780.
Nogami, Takeshi. “An Innovation to Integrate Porous Low-K Materials and Copper,” Honeywell Seminar. Dec. 6, 2001.
Padhi, et al. “Planarization of Cooper Thin Films by Electropolishing in Phosphoric Acid for ULSI Applications” Journal of the Electrochemical Society, 150 (1) (2003) pp. G10-G14.
Redeker Fritz
Sun Lizhong
Tsai Stan
Applied Materials Inc.
Nguyen George
Patterson & Sheridan
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