Semiconductor device manufacturing: process – Including control responsive to sensed condition – Optical characteristic sensed
Reexamination Certificate
2007-09-04
2007-09-04
Tsai, H. Jey (Department: 2812)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Optical characteristic sensed
C438S024000, C438S048000, C438S070000, C438S073000, C438S698000, C257SE33068
Reexamination Certificate
active
11064452
ABSTRACT:
A method of manufacturing a plurality of microlenses on a substrate comprises forming a grid having raised ridges defining a plurality of openings on the substrate and forming a plurality of patterned photoresist features each disposed within one of the plurality of openings. The plurality of patterned photoresist features can then be reflowed inside the grid.
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Ghandhi, VLSI Fabrication Principles, 1983, John Wiley & Sons, pp. 542-546.
Chang Bii-Junq
Chang Chih-Kung
Deng Jack
Kuo Chin Chen
Weng Fu-Tien
Haynes and Boone LLP
Taiwan Semiconductor Manufacturing Company , Ltd.
Tsai H. Jey
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