Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2002-12-09
2003-10-28
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
Reexamination Certificate
active
06638785
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to adsorbing device, adsorber, mounting device for a conductive member, adsorbing method and mounting method for a conductive member, semiconductor device and method of making the same.
2. Description of Related Art
In an process of assembling a semiconductor device to which BGA (Ball Grid Array), CSP (Chip Scale/Size Package) or the like is applied, a solder ball is mounted on the semiconductor device at an electrode forming location as a conductive member.
FIG. 23
is a perspective view schematically illustrating the structure of a solder-ball mounting device according to the prior art. The solder-ball mounting device comprises a vacuum chuck stage
10
for causing a mount head
50
to adsorb solder balls
54
(see FIG.
24
), a missing-ball detection lamp
20
and double-ball detection laser receiving and emitting units
30
, which are used to check whether or not the solder balls
54
have properly been adsorbed by the mount head
50
, a ball ejecting stage
40
for ejecting any solder ball
54
when it has not properly been adsorbed by the mount head
50
, and a mount stage
60
for mounting solder balls
54
adsorbed by the mount head
50
on a substrate at electrode forming locations.
In such a solder-ball mounting device, the solder balls
54
have been contained within a container on the vacuum chuck stage
10
. The mount head
50
is then inserted into this container. When the solder balls
54
are blown up from the container, the mount head
50
adsorbs the solder balls through the adsorption holes thereof.
More particularly, the mount head
50
has such a structure as shown in
FIGS. 24 and 25
. The mount head includes a main body
51
having an adsorption member
53
that is mounted on the bottom thereof. This adsorption member
53
includes a plurality of adsorption holes
70
formed therethrough. Each of the adsorption holes
70
is designed to adsorb one solder ball
54
.
The main mount head body
51
also includes a tube
52
connected to the top thereof. The tube
52
is then connected to a vacuum source (not shown). When the solder balls
54
are blown up from the container and reach near the adsorption member
53
on the mount head
50
, they will be attracted to and adsorbed by the adsorption holes
70
under the action of vacuum.
Subsequently, it is checked whether or not the solder balls
54
are properly adsorbed by the mount head
50
. There are two wrong manners in which the solder balls
54
are improperly adsorbed by the mount head
50
. In one wrong manner, a plurality of solder balls
54
is adsorbed by a single adsorption hole
71
, as shown in FIG.
24
. This will be referred to “double-ball state”. In the other wrong manner, there is an adsorption hole
72
having no adsorbed solder ball
54
, as shown in FIG.
25
. In other words, the adsorption member
54
does not have a predetermined number of adsorbed solder balls
54
. This will be referred to “missing state”.
FIG. 26
shows the relationship between the height of the mount head
50
(or the distance between the mount head
50
and the container) and the number of errors (or the number of re-adsorptions for solder balls improperly adsorbed by the adsorption holes). As shown in
FIG. 26
, the double-ball and missing states are contrary to each other. Considering both the double-ball state (D) and missing state (M), therefore, only a very narrow single-hatched range X can be utilized to reduce the number of errors (or production margin).
When the mount head
50
has moved to the position in which the missing-ball detection lamp
20
and double-ball detection laser receiving and emitting units
30
are located through any not-shown moving means, the mount head
50
may be irradiated by the missing-ball detection lamp
20
to detect any missing state. Any double-ball state in the mount head may be detected by the double-ball detection laser receiving and emitting units
30
.
More particularly, a camera or the like may be used to monitor the solder balls
54
irradiated by the missing-ball detection lamp
20
for detecting the missing state. The double-ball detection laser is also emitted slightly below one solder ball
54
and received by the light-receiving unit. If there is a double-ball state, the lower solder ball
54
will block the laser beam. This permits the double-ball state to be detected.
If a double-ball state is detected, all the solder balls
54
are removed from the adsorption member on the mount head
50
by breaking the vacuum at the ball ejecting stage
40
. Thereafter, the solder balls
54
will again be adsorbed by the adsorption member at the adsorption stage
10
. Thus, it is established that a solder ball
54
is adsorbed by each of all the adsorption holes
70
in the adsorption member
53
.
While maintaining such a situation, the mount head
50
is moved to the mounting stage
60
wherein the solder balls
54
are mounted on the substrate at electrode forming locations for electrical components.
In the above-mentioned process of mounting the solder balls, however, all the solder ball
54
already mounted must be removed to perform the re-adsorption when the double-ball state occurs. This raises a problem in productivity.
SUMMARY OF THE INVENTION
In order to overcome this problem, an object of the present invention is to provide an adsorbing device, adsorber, mounting device for a conductive member, adsorbing method and mounting method for a conductive member, semiconductor device and method of making the same which can effectively adsorb conductive members.
(1) A conductive-member adsorbing device according to a first aspect of the present invention comprises: an adsorber having a plurality of adsorption portions for adsorbing a plurality of conductive members, each of the adsorption portions creating an adsorption force that exceeds a force required to adsorb at least one of the conductive members being a predetermined number to be adsorbed by each of the adsorption portions; and a force supply unit for applying a force capable of maintaining an adsorbed state of the at least one conductive member being the predetermined number to be adsorbed by each of the adsorption portions, and capable of releasing at least one of the conductive members when a number of the conductive members adsorbed by one of the adsorption portions exceeds the predetermined number.
According to this aspect of the present invention, each of the adsorption portions can create an adsorption force exceeding a force adsorbing the at least one conductive member being the predetermined number. Thus, the at least one conductive member being the predetermined number can be adsorbed with a margin. Even if a number of the conductive members adsorbed by one of the adsorption portions exceeds, the force-supply unit can release at least one of these adsorbed conductive members. The force applied by the force supply unit maintains the at least one conductive member being the predetermined number adsorbed by one of the adsorption portions. Excessive conductive members adsorbed by the one adsorption portion can be removed while maintaining one conductive members adsorbed by the one adsorption portion. Therefore, it is not necessary to remove all the adsorbed conductive members from the adsorption member if the conductive members have improperly been adsorbed by the adsorption member. This provides an efficient adsorption.
(2) In the conductive-member adsorbing device, one of the conductive members may be predetermined to be adsorbed by each of the adsorption portions. Thus, one conductive member can only be adsorbed by one adsorption portion.
(3) In the conductive-member adsorbing device, a first adsorption direction in which the at least one conductive member being the predetermined number is adsorbed by one of the adsorption portions may be different from a second adsorption direction in which a number of the conductive members adsorbed by one of the adsorption portions exceeds the predetermined number; and the force supply u
Shindo Tomoyuki
Shiozawa Masakuni
Hoang Quoc
Nelms David
Oliff & Berridg,e PLC
Seiko Epson Corporation
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