Metal fusion bonding – Including means to apply flux or filler to work or applicator – Moving work
Patent
1996-07-01
1998-10-13
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Moving work
228 39, 118503, B23K 300
Patent
active
058200134
ABSTRACT:
A fixture for supporting printed circuit (PC) boards during wave soldering includes a rigid frame having a ledge formed along the inner perimeter of the frame. The ledge supports a PC board along a peripheral portion of the board. Channels are formed atop the frame for receiving slidably removable clamps. The fixture further includes a slidably removable rail coupled to the frame along its channels. The rail includes a ledge that is coplanar with the ledge of the frame. The rail can be adjusted to provide support for smaller PC boards. A drop-plate component includes a recessed area for receiving a PC board, and depressed regions for masking components on the board. Openings formed in the drop-plate expose desired areas of the board for soldering. The drop-plate, loaded with a PC board, fits into the frame along the ledges of the frame and/or the rail for a wave soldering operation.
REFERENCES:
patent: 4030717 (1977-06-01), Serlovsky
patent: 4948108 (1990-08-01), Sullivan
patent: 5067648 (1991-11-01), Cascini
patent: 5454505 (1995-10-01), Kearns
patent: 5456402 (1995-10-01), Curtin
patent: 5540376 (1996-07-01), Asla et al.
IBM Technical Disclosure Bulletin, vol. 34, No. 2, pp. 356-357, Jul. 1991.
Innovative Soldering Technologies
Ramsey Kenneth J.
Schneck Thomas
Yee George B. F.
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