Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent
1990-06-04
1992-11-10
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With cutting, punching, piercing, severing, or tearing
156521, 156522, 156552, B32B 3118
Patent
active
051620715
ABSTRACT:
A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.
REFERENCES:
patent: 3750510 (1973-08-01), Gabriels
patent: 4323416 (1982-04-01), Malthouse et al.
patent: 4585509 (1986-04-01), Obayashi
patent: 4964937 (1990-10-01), Seki
patent: 4986873 (1991-01-01), Hamamura
Hamamura Fumio
Nagafuchi Yasuhiro
Seki Mitsuhiro
Sumi Shigeo
Somar Corporation
Weston Caleb
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