4. Cutting
  5. Tool engages work during dwell of intermittent workfeed
  6. Unicyclic

Yasuhiro Nagafuchi

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Adjustable film cutoff unit

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent

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Apparatus for bonding continuous thin film to discrete base plat

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent

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Apparatus for bonding continuous thin film to discrete base plat

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With cutting – punching – piercing – severing – or tearing
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Apparatus for bonding continuous thin film to discrete base plat

Cutting – Tool engages work during dwell of intermittent workfeed – Unicyclic
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-799162

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