Adhesive tapes for die bonding

Details Adhesive tapes for die bonding Adhesive tapes for die bonding

1989-03-20

1990-06-12

Thomas, Alexander S.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Halogen containing compound

428355, 428906, 525438, 252511, B32B 706, B32B 712

Patent

active

049332198

ABSTRACT:
An adhesive tape for die bonding is disclosed, comprising a continuous tape wound on a reel, the continuous tape having a structure that an adhesive layer composed mainly of a filler and a binder comprised of an epoxy resin and a polyester resin is laminated on a release film. According to the adhesive tape for die bonding of the invention, bonding of semiconductor elements can be attained with good workability and high reliability by very easily handling of the adhesive tape.

REFERENCES:
patent: 2599359 (1952-06-01), Banks et al.
patent: 3741786 (1973-06-01), Torrey
patent: 4410457 (1983-10-01), Fujimura et al.
patent: 4574056 (1986-03-01), Kimura
patent: 4695508 (1987-09-01), Kageyama et al.
patent: 4696764 (1987-09-01), Yamazaki

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