Adhesive layer in multi-level packaging and organic material as

Details Adhesive layer in multi-level packaging and organic material as Adhesive layer in multi-level packaging and organic material as

1991-10-07

1994-07-05

Ryan, Patrick J.

Stock material or miscellaneous articles

Composite

Of metal

428209, 4284735, 428901, B32B 900

Patent

active

053266439

ABSTRACT:
The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.
In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.
A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

REFERENCES:
patent: 3770573 (1973-11-01), Dunphy et al.
patent: 4775449 (1988-10-01), Dumas et al.
patent: 4788098 (1988-11-01), Sado et al.
patent: 4871619 (1989-10-01), Araps et al.
Jerry March, Reactions, Mechanisms and Structure, Advanced Organic Chemistry, Second Edition, pp. 478-479, 482-485, 598-599.
Patterson, et al., The Ring Index, American Chemical Society Monograph Series, Reinhold Publishing Corporation, New York, pp. 44, 54.

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