4. Electrolysis: processes, compositions used therein, and methods
  5. Electrolytic coating
  6. Depositing predominantly single metal or alloy coating on...

Jungihl Kim

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Adhesive layer in multi-level packaging and organic material as

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Adhesive layer in multi-level packaging and organic material as

Stock material or miscellaneous articles – Composite – Of metal
Patent

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Adhesive layer in multi-level packaging and organic material as

Coating processes – Coating remains adhesive or is intended to be made adhesive
Patent

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Connector assembly for chip testing

Electrical connectors – Including handle or distinct manipulating means – Randomly manipulated implement
Patent

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Formation of metallic interconnects by grit blasting

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof
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Profile ID: LFUS-PAI-P-534491

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