Adhesive and encapsulating material with fluxing properties

Details Adhesive and encapsulating material with fluxing properties Adhesive and encapsulating material with fluxing properties

2005-12-06

2005-12-06

Ciric, Ljiljana (Department: 3753)

Metal working

Method of mechanical manufacture

Electrical device making

C428S413000, C428S418000, C252S510000, C252S512000

Reexamination Certificate

active

06971163

ABSTRACT:
The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chemical cross-linking agent which has fluxing properties but which is unreactive or of severely restricted reactivity with the polymer without the action of heat and/or catalyst. The composition is to be thermally curable when heated to soldering temperatures in a reaction which is catalyzable merely by metal oxide fluxed from metal surfaces by cross-linking agent then dissolved in the thermosetting polymer.

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