Adhesive, adhesive member, interconnecting substrate for...

Details Adhesive, adhesive member, interconnecting substrate for... Adhesive, adhesive member, interconnecting substrate for...

2005-01-04

2005-01-04

Buttner, David J. (Department: 1712)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550AC, C525S119000, C525S113000, C523S457000, C524S556000, C524S786000, C524S789000, C257S783000

Reexamination Certificate

active

06838170

ABSTRACT:
An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.

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