Adhesion promotion vacuum monitoring system for photo resist...

Measuring and testing – With fluid pressure

Reexamination Certificate

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C073S049200, C702S051000

Reexamination Certificate

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10983456

ABSTRACT:
An apparatus and method for monitoring pressure within an adhesion promotion unit is provided. The apparatus in one embodiment includes a chamber configured to receive and heat a semiconductor wafer. A vacuum device is in fluid communication with a processing space within the chamber, wherein the vacuum device is configured to create a vacuum within the processing space. A vacuum monitor is also in fluid communication with the processing space, wherein the vacuum monitor generates a first electrical signal if gas pressure within the processing space is below a predetermined value. The apparatus may further include a processor in data communication with the vacuum monitor and the vacuum device. The vacuum device may generate a second electrical signal, and the processor generates a third electrical signal if the vacuum monitor fails to generate the first electrical signal within a predetermined amount of time after the vacuum device generates the second signal.

REFERENCES:
patent: 4902398 (1990-02-01), Homstad
patent: 5433020 (1995-07-01), Leech, Jr.
patent: 5716453 (1998-02-01), Chen
patent: 6156125 (2000-12-01), Harada
patent: 6409838 (2002-06-01), Sakai
patent: 6494100 (2002-12-01), French, Jr.

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