Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-08-01
2006-08-01
Schilling, Richard L. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S271100, C430S278100, C430S302000, C430S330000, C430S910000, C430S964000
Reexamination Certificate
active
07083895
ABSTRACT:
Imageable elements, useful as on press developable lithographic printing plate precursors, are disclosed. The elements comprise an imageable layer over a substrate and an one or more adhesion promoting ingredients. The imageable layer comprises a polymerizable compound and a polymeric binder. The adhesion promoting ingredients are titanium chelate and/or co-polymers of a monomer having a polethylene oxide side chain with a monomer having either an acidic group or an anhydride group that has been ring opened to form an acidic group or groups.
REFERENCES:
patent: 4427766 (1984-01-01), Mohr
patent: 6582882 (2003-06-01), Pappas et al.
patent: 2003/0064318 (2003-04-01), Huang et al.
patent: 2004/0260050 (2004-12-01), Munnelly et al.
DuPont™TYZOR® Organic Titanates—General Brochure, Copyright 2001, E.I. du Pont de Nemours and Company, Wilmington, DE.
Clark Eric
Huang Jianbing
Hunter Joseph
Mulligan James
Shashikant Saraiya
Kodak Polychrome Graphics LLC
Schilling Richard L.
Tucker J. Lanny
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