Adhesion promoter for additively plated printed circuit boards

Details Adhesion promoter for additively plated printed circuit boards Adhesion promoter for additively plated printed circuit boards

1977-11-07

1978-11-28

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 29, 134 41, 156629, 156901, 427309, C23F 100, C03C 2300, C23G 100

Patent

active

041274385

ABSTRACT:
Subsequent to the additive plating of copper circuitry on a substrate and prior to further steps such as lamination to form a multilayer printed circuit board, a sequence of etching and cleaning steps are used to improve the lamination strength of the additively plated copper. The circuitized substrate is dipped in an etchant bath and then baked at an elevated temperature for 2-4 hours. Following this the circuitized substrate is washed with an organic cleaner, water rinsed and air dried. Thereafter a chlorite oxide layer is added to the circuitized substrate and it is ready for further processing.

REFERENCES:
patent: 2963538 (1960-12-01), Dahlgren
patent: 3020175 (1962-02-01), Penczek et al.
patent: 3562039 (1971-02-01), Strohmayer et al.
patent: 3837929 (1974-09-01), Cauk

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