Adhesion method and electronic component

Details Adhesion method and electronic component Adhesion method and electronic component

2005-07-19

2005-07-19

Pham, Long (Department: 2814)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S275700, C257S720000

Reexamination Certificate

active

06918983

ABSTRACT:
The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device2, power source4, light source or other components used for the electric products, and an electronic component excellent in radiation.

REFERENCES:
patent: 8-245833 (1996-09-01), None
patent: 2000-92609 (2000-03-01), None

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